| 摘要 |
A food waste annihilating apparatus is provided to simplify the structure of the apparatus, minimize the size of the apparatus, minimize the production cost, and control operation of the apparatus smoothly and certainly by comprising a semiconductor water removing part installed as a water removal equipment. In a water removal equipment comprising a drying chamber(110) formed in a predetermined box shape to contain food waste, a heater part(120) for supplying heated air into the drying chamber, a water removal part that is in communication with an upper part of the drying chamber to remove water contained in air exhausted, and a blowing fan(130) for supplying water-removed air of the water removal part to the heater part, a food waste annihilating apparatus is characterized in that the water removal part is a semiconductor water removing part for removing water by an icing semiconductor. The semiconductor water removing part includes an icing semiconductor(11), a cooling part(12), radiation fins(13), a cooling fan(18), a condensing pipeline(14), a condensing chamber, a temperature sensor(17), a condensation controller(16), a drain part(16), and a water discharge part(19). The food waste annihilating apparatus further comprises a sewage disposal tank(140).
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