METHOD OF MEASURING THICKNESS OF A THIN LAYER ON A SUBSTRATE AND APPARATUS FOR PERFORMING THE SAME

摘要

An apparatus for measuring a thickness of a thin layer and a method thereof are provided to improve a measurement reliability of data by removing signal generated from a boundary region. A method for measuring a thickness of a thin layer comprises the step of emitting light to the thin layer formed on a cell region and a boundary region of a semiconductor substrate(S110). Light signal reflected from the cell region is selectively extracted among light reflected from the semiconductor(S120). Spectrum is obtained by performing a fourier-transformation on the extracted light signal(S130). The thickness of the thin layer is output by analyzing the obtained spectrum(S140). The light signal is extracted by using a filter having a blocking pattern corresponding to the boundary region.