| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit package and its manufacturing method, wherein after mounting to a board also, a characteristic of each terminal of a semiconductor integrated circuit can be simply checked by the package itself. <P>SOLUTION: In a flexible board 201, solder balls 101<SB>1</SB>, 101<SB>2</SB>, 101<SB>3</SB>, 101<SB>4</SB>are electrically connected to a conductive pattern formed on a lower face of a board 201A, the remaining portion is curved, and a board 201B is adhered to an upper side thereof across an IC chip 104 and a stiffner 111. Probing pads 203<SB>1</SB>, 203<SB>2</SB>, 203<SB>3</SB>, 203<SB>4</SB>for checking are disposed on an upper face of the board 201B in such a form that they are individually conducted to a corresponding one of the solder balls 101<SB>1</SB>, 101<SB>2</SB>, 101<SB>3</SB>, 101<SB>4</SB>. <P>COPYRIGHT: (C)2008,JPO&INPIT |
