| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit board having protruding electrodes, whereby the buildups of its resin which are generated on the end surfaces of its plurality of protruding electrodes are so eliminated as to be able to connect it surely electrically with a mounting board, by utilizing the whole of the end surface of each protruding electrode as a solder joining surface and as to be able to improve its connecting reliability. <P>SOLUTION: A circuit board 10 having protruding electrodes has a circuit board 11 having a predetermined circuit pattern 11B, and has a plurality of protruding electrodes 12 arrayed in the peripheral edges of the first principal surface of the circuit board 11 and extended in the vertical direction from the first principal surface. The manufacturing method of a circuit board having protruding electrodes has a first process for creating the circuit board 10 having protruding electrodes, a second process for forming a liquid repellent coating 18 on at least the end surface of each protruding electrode 12, and a third process for applying to the first principal surface of the circuit board 11 a liquid resin 114 having a low wettability to the liquid repellent coating 18. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
