发明名称 METHOD AND APPARATUS FOR PROCESSING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a method for preventing re-adhesion of splashing liquid drops to a substrate by suppressing splash of liquid at the circumferential edge of the substrate during a spin-drying process with the substrate, by scanning a discharge nozzle while cleaning liquid is discharged from it to the surface of substrate. SOLUTION: A discharge port of a pure-water discharging nozzle is scanned to the position opposing to the circumferential edge of the substrate from the position opposing to the center of substrate, while the substrate W is rotated around the longitudinal axis with a rotating motor 14 by holding the substrate in the horizontal attitude with a spin chuck 10, and the cleaning liquid is discharged from the discharge port of the pure-water discharging nozzle 20. At this time, rotating rate of the substrate is lowered in the process that the discharge port of the discharge nozzle moves to the position opposing to the circumferential edge of substrate from the position opposing to the center of substrate. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007311439(A) 申请公布日期 2007.11.29
申请号 JP20060137182 申请日期 2006.05.17
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 HORI SHINPEI;SANADA MASAKAZU;GOTO TOMOHIRO
分类号 H01L21/027;G03F7/30 主分类号 H01L21/027
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