| 摘要 |
PROBLEM TO BE SOLVED: To suppress a temperature rise of an electronic component during operation while holding a support plate of a semiconductor device over the whole face via a uniform and very small gap with respect to a heat sink. SOLUTION: The semiconductor device is provided with the heat sink (1), the support plate (3) which is arranged on one main face (1a) of the heat sink (1) while being separated from the heat sink (1) via at least one electrically-insulating spacer (2), and a semiconductor chip (4) fixed onto the support plate (3). The spacer (2) is hardened by irradiation of ultraviolet rays without generating shape changes such as contraction or expansion in the spacer (2). Consequently, it is possible to hold the support plate (3) over the whole support face (2a) of the spacer (2) in a uniform gap (8) with a very small height with respect to the heat sink (1). COPYRIGHT: (C)2008,JPO&INPIT
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