| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for laminates capable of providing an organic substrate prepreg, a metal foil-clad laminate and a printed circuit board each excellent in laser machining property in small diameter, reliability in stack via conformation, measling resistance, etc. and the metal foil-clad laminate and a printed circuit board. SOLUTION: The present invention provides the resin composition for laminates containing (A) an epoxy resin containing a naphthalene skeleton-containing epoxy resin and (B) an epoxy resin curing agent containing a novolak type phenol resin having at least one kind of skeleton selected from a naphthol skeleton, a naphthalene diol skeleton, a biphenyl skeleton and a dicyclopentadiene skeleton in the molecular structure, and the prepreg, the metal foil-clad laminate and the printed circuit board each using the resin composition. COPYRIGHT: (C)2008,JPO&INPIT
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