| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin that is useful for an insulating material for electric/electronic components (such as a highly reliable semiconductor-sealing material), various composite materials including laminates (printed wiring boards, build-up substrates or the like) and CFRP, adhesives, coatings and the like, exhibits excellent flame retardancy and gives a cured product exhibiting excellent heat resistance and flexibility. SOLUTION: The epoxy resin is obtained by causing a mixture of at least two selected from among 4,4'-dihydroxybiphenylmethane, 2,4'-dihydroxybiphenylmethane and 2,2'-dihydroxybiphenylmethane, biphenol and an epihalohydrin to react. COPYRIGHT: (C)2008,JPO&INPIT
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