发明名称 Allowance Method for Point to Ground Resistance of Tray
摘要 Disclosed is a method of providing a desired range of point-to-ground resistance to trays, by making a conductive pathway between both surfaces of the tray after forming and cutting processes. A desired range of point-to-ground resistance of the tray can be achieved by partially or entirely coating a conductive solution composed of a conductive polymersuch as polyaniline, polypyrrole, polythiophene and derivatives such as poly 3,4-ethylenedioxythiophene and mixtures thereof, metal powders and flakes composed of iron, copper, aluminum and other metals, metal oxides such as doped tin oxide and indium oxide, onto cut surfaces of the tray, by attaching a conductive or semi-conductive tape to top and bottom surfaces of the tray so as to cross them, or by using a metal clip. Thereby, a desired range of point-to-ground resistance can be provided to the tray by electrically connecting the top and bottom surfaces of the tray.
申请公布号 US2007272589(A1) 申请公布日期 2007.11.29
申请号 US20040550056 申请日期 2004.03.22
申请人 SUH KWANG S;KIM JONG E 发明人 SUH KWANG S.;KIM JONG E.
分类号 C09D5/24;H01B1/24;C09K3/16;H01B1/12;H01B1/20;H01B1/22;H01L21/673 主分类号 C09D5/24
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