Ultrasound transducer and method for implementing flip-chip two dimensional array technology to curved arrays

摘要

An ultrasound transducer probe ( 40 ) includes a support substrate ( 54 ), an integrated circuit ( 42 ) and an array of piezoelectric elements ( 50 ). The support substrate ( 54 ) has a non-linear surface ( 55 ). The integrated circuit ( 42 ) physically couples to the support substrate ( 54 ) overlying the non-linear surface ( 55 ), wherein the integrated circuit ( 42 ) substantially conforms to a shape of the non-linear surface ( 55 ). An array of piezoelectric elements ( 50 ) couples to the integrated circuit ( 42 ).