发明名称 |
Halbleitermodul |
摘要 |
A semiconductor module includes a housing with at least one semiconductor component that is conductively connected to at least one output line. An integrated temperature sensor is also housed in the housing. This sensor is connected, via at least one of its load terminals, to a terminal for receiving a supply potential. The temperature sensor conducts a load current that heats-up the temperature sensor when a first temperature threshold is crossed and a supply potential is in being supplied. A housed interruption device is arranged in such a way that it interrupts the output lines carrying the load current when a second temperature threshold has been exceeded. |
申请公布号 |
DE10122363(B4) |
申请公布日期 |
2007.11.29 |
申请号 |
DE2001122363 |
申请日期 |
2001.05.09 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
GRAF, ALFONS;TROEGER, WOLFGANG;TIHANYI, JENOE |
分类号 |
H01L23/62;H01L23/34;H01L25/07 |
主分类号 |
H01L23/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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