| 摘要 |
A printed wiring board, a method for forming the printed wiring board, and a board interconnection structure are provided to improve interconnection force between connection terminals by forming fillets on both sides of a slit. A printed wiring board includes a first printed wiring board(1), a second printed wiring board(2), and a connection layer(19). The first printed wiring board includes a first conductive circuit. The first conductive circuit is arranged on a first insulation layer(10) and has a first connection terminal(11a). The first connection terminal has a width(W1) of an upper plane narrower than a width(W2) of a lower plane. The second printed wiring board includes a second conductive circuit. The second conductive circuit is arranged on a second insulation layer(12) and has a second connection terminal(13a). The connection layer has fillets(23) on both sides thereof and connects the first and second connection terminals. |
