| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a structure allowing a modular type connector to mix a single end and differential signal contact therein, and to respond to high speed and high density, and simple in manufacturing work. <P>SOLUTION: The connectors 114 and 116 comprise two pieces with one piece 114 having pins 122 and a shield 128 and the other piece 116 having socket type signal contacts 158 and shield plates 150. The shields 128 and 150 have a grounding structure which is adapted to control the electromagnetic fields, for various device architectures, simultaneous switching configurations and signal speeds, allowing all of the socket type signal contacts to be used for signal transmission. Additionally, at least one piece of the connector 116 is manufactured from wafers 154, with each ground plane and signal column injection molded into respective components, and when combined, the respective components 166 and 168 form a wafer 154. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
