| 摘要 |
<p>A solder resist composition for a flexible substrate, a flexible substrate having a solder resist comprising the composition, and a method for preparing the flexible substrate by using the composition are provided to improve stiffness, flexibility, heat resistance and thermal conductivity. A solder resist composition for a flexible substrate comprises a hydrogenated biphenyl type epoxy resin; and a rubbery compound having a functional group reacting with an epoxy group. Also the solder resist composition for a flexible substrate comprises a hydrogenated biphenyl type epoxy resin; a rubbery compound having a functional group reacting with an epoxy group; and 60-95 wt% of an aluminum oxide particle. Preferably the average hydrogenation rate of the hydrogenated biphenyl type epoxy resin is 5-95 %.</p> |
