| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing method of a circuit board as well as a circuit board device of which the redundant potting material is surely removed with ease. SOLUTION: A case 20 is provided with a flange 27 which acts as a fitting part where a redundant potting material P is fitted. The potting material P is injected while a circuit board 10 is housed in the opening 22 of the case 20. The flange 27 is removed after the potting material P is hardened. Since a redundant part P' of the potting material is fitted to the flange 27, and removed after the potting material P is hardened together with the flange 27, the redundant part P' of the potting material can be easily and surely removed, resulting in improving workability in a sealing process of the circuit board 10. COPYRIGHT: (C)2008,JPO&INPIT
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