| 摘要 |
PROBLEM TO BE SOLVED: To reduce the costs of a substrate for power modules by reducing the usage of a volatile organic medium. SOLUTION: The method of manufacturing the substrate 11 for power modules includes: a lamination step of forming a laminate by placing a circuit layer 13 onto the surface of a ceramics plate 12 through brazing filler metal foil, and a junction step of brazing a circuit layer 13 onto the surface of the ceramics plate 12 by pressurizing and heating the laminate in a lamination direction to form the substrate 11 for power modules. In the lamination step, the circuit layer 13 is opened toward a position at which the circuit layer 13 is arranged on the surface of the ceramics plate 12, and is placed onto the surface of the ceramics plate 12 through the brazing filler metal foil to form the laminate, while the circuit layer 13 is fitted into a positioning hole 24 having an inner-periphery surface of which the shape and size are the same as those of the outer periphery edge of the circuit layer 13. In the junction step, the laminate is pressurized in the lamination direction for heating to form the substrate 11 for power modules while the circuit layer 13 is fitted into the positioning hole 24. COPYRIGHT: (C)2008,JPO&INPIT
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