| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure of a semiconductor device and its manufacturing method, wherein the semiconductor device is hardly deformed or destroyed even when it is subjected to external force. SOLUTION: The semiconductor device comprises a plurality of wiring electrodes 3 provided on a semiconductor substrate 1, and air bridge electrodes 6 each provided between predetermined wiring electrodes among the plurality of the wiring electrodes 3. For connection between the wiring electrode 3 and the air bridge electrode 6, a dug part 3b is formed in the wiring electrode 3 and a connection 6b of a leg of the air bridge electrode 6 is embedded in the dug part 3b. COPYRIGHT: (C)2008,JPO&INPIT
|
