| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for preparing an inspection recipe for a semiconductor wafer in high accuracy and at high throughput. SOLUTION: At least either of a wafer parameter as a settable inspection information and a sensitivity parameter of a defect inspection device is generated from the design information of a semiconductor wafer, and incorporated into a recipe for defect inspection. The defect inspection device is unnecessary to be occupied for the preparation of the recipe because a semiconductor wafer to be inspected is not actually used, and the defect inspection can be carried out without lowering the throughput of the device. COPYRIGHT: (C)2008,JPO&INPIT
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