MANAGED MEMORY COMPONENT

摘要

A system and method for combining a leaded package IC (12) and a semiconductor die (14) using a flex circuitry (20). The leaded packaged IC (12) is disposed along an obverse side of a flex circuit. In a preferred embodiment, the lower surface of the body of the leaded packaged IC (12) contacts the surface of the flex circuitry (20). The semiconductor die (14) is disposed beneath the leaded package IC (12) and, in preferred embodiments, disposed in a window that passes through at least a part of the flex circuitry (20) and is attached to a conductive layer of the flex circuitry (20). In other embodiments, the semiconductor die is attached to the body of the leaded packaged IC. The flex circuitry preferably employs at least two conductive layers (20M1, 20M2).