A metal plating method of stone surface is provided to impart metal functionalities such as conductivity to the stone surface by forming a compact thick plating layer on a surface of stone and beautify external appearance of the stone surface by performing a metal plating process on a porous structure(pores) in the stone surface. A metal plating method of stone surface comprises: a degreasing process(S10) of removing contaminants and alien substances on a surface of stone; a masking process(S20) of masking a masking agent on an exposure area of the stone surface; an etching process(S30) of etching the masking agent masked on the stone surface using an etchant; an impregnating hydrophilic process(S40) of impregnating the stone surface with an impregnation solution; a metal dipping process(S50) of dipping the stone surface into an aqueous Pd solution or an aqueous Pd-stone alloy solution; a reduction treating process(S60) of dipping the stone surface into an aqueous sodium hydroxide solution; a chemical plating process(S70) of dipping the stone surface into a Cu or Ni electroless-plating solution; an electro-Cu plating process(S80) of performing electroplating of the stone surface using copper sulfate containing a luster; an electro-Ni plating process(S90) of plating the stone surface using an aqueous nickel sulfate solution; an electro-Au plating process(S100) of performing Au plating of the stone surface as a finishing plating; a coating process(S110) of coating the stone surface with a discoloration preventing agent or a coating agent; a masking removing process(S120) of removing the masking agent from the stone surface; and a laser marking process(S130) of irradiating a laser beam onto a plating layer to remove a thin film from the plating layer.
