| 摘要 |
A solid-state image sensor 2, a transparent cover 6, a DSP 8, a wiring board 7 and the like are sealed in a sealing portion 14 by molding of a synthetic resin, and fixed to an imaging unit 1. At this time, a portion of the transparent cover 6 is exposed from the sealing portion 14. The optical path fixing device 20 and the imaging unit 1 sealed by the sealing portion 14 are fixedly combined by engagement of hook engaging portions 28 and hook portions 16, in a state where the lower end surface of a lens barrel 22 comes into contact with the exposed portion. As the result, positioning accuracy of a lens 21 with respect to a pixel area of the solid-state image sensor 2 dose not deteriorate even if a substrate on which the solid-state image sensor 2 is arranged is deflected or distorted. |
