| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device in which a good fillet is formed even at a corner portion. <P>SOLUTION: Wettability reduction regions 7a-7d exhibiting lower wettability to a softened sealing resin material 5 than to the surface of a wiring board 2 are formed on the side of the wiring board 2 in positions on the outside of a mounted semiconductor element 1 along the sides 1a, 1b, 1c and 1d touching the corner portion 6 of the semiconductor element 1, so that the sealing resin material flowing out from the side touching the corner portion of the semiconductor element 1 is guided to the corner portion 6. <P>COPYRIGHT: (C)2008,JPO&INPIT |
