| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a process for manufacturing a semiconductor integrated circuit device in which a good fillet is formed even at a corner portion. <P>SOLUTION: A planar sealing resin material 5 where the portions 8a, 8b, 8c and 8d corresponding to the corner portions are projecting as compared with the portions 7a, 7b, 7c and 7d corresponding to the sides of a semiconductor element touching the corner portions is interposed between the semiconductor element 1 and a wiring board 2 and hot pressed. Softened sealing resin material 5 is thereby spread to the outside of the semiconductor element 1 and a fillet is formed. <P>COPYRIGHT: (C)2008,JPO&INPIT |
