| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a low profile surface-mounting semiconductor device of high reliability. <P>SOLUTION: The semiconductor device comprises a conductive plate 40 having a recess, a semiconductor chip 30 bonded to the recess through one electrode; a first surface-mounting external connection terminal 3 which is bonded to the other electrode of the semiconductor chip 30, and protrudes almost vertically relative to the conductive plate 40; a second surface-mounting external connection terminal 4 which is bonded to the conductive plate 40, and protrudes in the same direction as the first external connection terminal 3; and a sealing resin 13 that covers the entire except for the tips of the first external connection terminal 3 and the second external connection terminal 4. Since the external connection terminal 4 is connected to the semiconductor chip 30 using the conductive plate 40, the height of a resin package 13 can be reduced by the height of loop of a wire compared with the case of connecting with wire for lower profile. There is no possibility of shorting or disconnection because of wireless type for high reliability. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
