| 摘要 |
PROBLEM TO BE SOLVED: To provide a package substrate for mounting a semiconductor element with favorable connection reliability, and provide a substrate for mounting a semiconductor element with a stress relaxation layer that is advantageous in terms of the formation of fine wiring, electrical characteristics and manufacturing cost, and its manufacturing method. SOLUTION: A substrate for mounting a semiconductor element with a stress relaxation layer has the stress relaxation layer with a thickness of 0.5 to 40μm having an elastic modulus of 3 GPa or smaller and an elongation percentage of 5% or lower between copper foil and a prepreg. The stress relaxation layer is characterized by comprising a resin composition containing (A) an epoxy resin, (B) a high molecular component, (C) an epoxy resin curing agent, and (D) a hardening accelerator. COPYRIGHT: (C)2008,JPO&INPIT |
