| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device wherein no load is given to a solder junction when deforming a heat sink like a convex to be projected to the side of a cooler in a previous step for securing the heat sink to the cooler, and to provide the heat sink. SOLUTION: The heat sink 4 is a composition member of a semiconductor device, and is provided with a low-rigidity area 12 having a groove 13, and high-rigidity areas 11 and 11 which are formed in regions wherein semiconductor elements 2 and 2 are bonded by solder, respectively. Thus, when the heat sink 4 is deformed like a convex to be projected to the side of a cooler in a previous step for securing the heat sink 4 to the cooler; the low-rigidity area 12 of the heat sink 4 is pressed down, and the heat sink 4 is locally bent like a convex from the periphery of the low-rigidity area 12. As a result, the deformation of the solder junctions 6 and 6 in the heat sink 4 is suppressed, the shearing elastic strain of the solder junctions 6 and 6 can be reduced than heretofore, and solder bonding strength can be also improved. COPYRIGHT: (C)2008,JPO&INPIT
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