| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin multilayer board capable of connecting a wiring pattern to a chip-type electronic component in resin without using any solder, and enhancing the degree of freedom when providing the wiring pattern connected to the chip-type electronic component, to provide a compound electronic component, and to provide manufacturing methods of the resin multilayer board and the compound electronic component. <P>SOLUTION: The resin multilayer board 10 comprises: a resin laminate 11 having the wiring pattern 11A, while a plurality of resin layers are laminated; and the chip-type electronic component 12 that is built into the resin laminate 11, and has a pair of external electrodes 12A on both the sides. The wiring pattern 11A and the side of at least one external electrode 12A are connected electrically between the upper and lower surfaces of the chip-type electronic component 12. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
