| 摘要 |
An electronic component adapted to be mounted on a substrate with landing pads having a landing pad layout has a power semiconductor device and outer contact surfaces with a component pad layout. The outer contact surfaces have an arrangement so that, in a first orientation, the component pad layout matches the landing pad layout and in a rotational reorientation of the entire electronic component about the component axis by an angle other than 360°, the outer contact surfaces are translated to each other so that the component pad layout matches the landing pad layout.
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