Ultrasound Transducer and Method for Implementing High Aspect Ration Bumps for Flip-Chip Two Dimensional Arrays

摘要

An ultrasound transducer ( 100 ) comprises an integrated circuit ( 52 ) and an array of acoustic elements ( 92,94,96 ) coupled to the integrated circuit via flip chip bumps ( 76,78 ). The flip chip bumps comprise high aspect ratio bumps having an aspect ratio greater than 1:1. The aspect ratio comprises a ratio of a bump height ( 82 ) to a bump width ( 84 ).