Micromechanical pressure transducer for capacitive microelectromechanical system microphone, has substrate-sided cavity forming back volume for movable membrane, and resting at application-specific integrated circuit chip

摘要

The pressure transducer has a microphone chip (1) with an electrically conductive movable diaphragm (6), and an application-specific integrated circuit (ASIC) chip (2). The ASIC chip processes information by movement of the diaphragm. One of the two chips has a substrate-side opened cavity (17), and both chips are electrically and mechanically connected with one another. The cavity forms a back volume for the movable diaphragm, and rests at the ASIC chip. An independent claim is also included for a method for manufacturing a micromechanical pressure transducer.