发明名称 POLISHING LIQUID COMPOSITION
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a polishing liquid composition capable of providing small surface roughness of an object to be polished after polishing and remarkably reducing nanoscratches, and a manufacturing method of a substrate having small surface roughness and remarkably reduced nanoscratches. <P>SOLUTION: This polishing liquid composition contains a polishing material having an average particle diameter≥1 nm and <40 nm of primary particles. A zeta potential of the polishing material in the polishing liquid composition is -15 to 30 mV. In this manufacturing method of the substrate, a polishing process using the polishing liquid composition having the zeta potential adjusted to -15 to 30 mV of the polishing material is provided. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2007301721(A) 申请公布日期 2007.11.22
申请号 JP20070222603 申请日期 2007.08.29
申请人 KAO CORP 发明人 YOSHIDA HIROYUKI;HONMA YUICHI
分类号 B24B37/00 主分类号 B24B37/00
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