| 摘要 |
PROBLEM TO BE SOLVED: To prevent damage on a wafer occurring after thinning process of wafer, and to hold down the processing cost of a wafer. SOLUTION: A rotatable index table 41 is arranged on a device base 10a, and seven chuck tables 40 for suction fixing the wafer while directing the backside upward are arranged thereon. Under a state vacuum sucked to the chuck table 40, the wafer is made thin by grinding the backside in a first processing unit 50 and a second processing unit 70. Subsequently, under a state where the wafer is sucked and fixed to the chuck table 40, the index table 41 turns serially and polishing, cleaning on the backside of the wafer and sticking of a bonding film for laminating a semiconductor chip are performed before a dicing tape is stuck finally using a frame mount unit 111. Since the dicing tape is stuck without releasing vacuum suction state after the thinning process, damage on the thinned wafer due to application of a stress is prevented and processing cost can be reduced. COPYRIGHT: (C)2008,JPO&INPIT |
