发明名称 SHUTTER DEVICE AND SURFACE TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a surface treatment apparatus that enables a substrate to be observed from a position at which a good visual field and a measuring circumstance can be obtained, and simultaneously prevents a film-forming material depositing on the surface of the shutter from falling and contaminating the source of the film-forming material. SOLUTION: A shutter device 113 comprises: a shutter 116; and a directly acting mechanism 120 for moving the shutter 116 in between the first position 118 and the second position 119. The directly acting mechanism 120 moves the shutter 116 in such a movement range as a crucible 108 is not arranged right under the shutter 116. When the directly acting mechanism 120 has set the shutter 116 at the first position 118, the region is enlarged which is intercepted by the shutter 116 for intercepting the film-forming material 107 from depositing on a substrate (A). COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007302924(A) 申请公布日期 2007.11.22
申请号 JP20060130652 申请日期 2006.05.09
申请人 SHARP CORP 发明人 FUTAGAWA MASAYASU;KAKIMOTO NORIKO
分类号 C23C14/24;H01L21/205 主分类号 C23C14/24
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