Electronic integrated circuit manufacturing method, involves fixing casing of electronic component in provided assembling space on internal casing carrier e.g. printed circuit board, and applying adhesive on space

摘要

The method involves fixing a casing (1) of an electronic component in a provided assembling space on an internal casing carrier (2) e.g. printed circuit board. An adhesive is applied on the provided assembling space in a screen printing process, laminating process and a dispensation process, and a soldering paste pressure is applied in connection to the assembling space. A b-staging-process takes place for partial adhesive interconnection and/or concentration reduction of an adhesive solvent in an area of the assembling space after applying the adhesive. An independent claim is also included for an electronic integrated circuit having an electronic component.