发明名称 |
Verfahren zur Lötstopp-Strukturierung von Erhebungen auf Wafern |
摘要 |
Process for solder-stop structuring protrusions on wafers (3) such as three dimensional contact structures (1) in the form of elastic or flexible contact bumps comprises depositing a resist on the tip of the three dimensional structure, depositing a solder-stop layer over a metallization including the resist, and removing the resist on the tip of the three dimensional structure including the solder-stop layer covering it. |
申请公布号 |
DE10241589(B4) |
申请公布日期 |
2007.11.22 |
申请号 |
DE2002141589 |
申请日期 |
2002.09.05 |
申请人 |
QIMONDA AG |
发明人 |
BRINTZINGER, AXEL;UHLENDORF, INGO;SCHENK, ANDRE;WOLLANKE, ALEXANDER |
分类号 |
H01L21/60;H01L21/44;H01L23/485 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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