| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem due to a polishing implement used by making direct contact with a polishing cloth. <P>SOLUTION: The polishing implement is composed of a base part 101 formed by machining an epoxy glass plate where a matrix resin made of an epoxy resin is impregnated with a sheet shape substrate such as glass woven cloth and glass nonwoven cloth, and a diamond like carbon (DLC) film 102 formed on the surface of the base part 101. A tooth par is formed on the periphery of a polishing carrier 10. In the polishing device, the tooth part is meshed with a sun gear and a planetary gear respectively, and a polishing carrier 100 performs a sun-and-planet motion by the rotation of the sun gear. A wafer of polishing target is stored in a storage area 103 provided on the polishing carrier 100. For example, the both sides of the wafer are polished with a polishing cloth disposed on both surface sides of the polishing carrier 100. <P>COPYRIGHT: (C)2008,JPO&INPIT |
