发明名称 METHOD OF FORMING POLISHING PAD FOR CHEMICAL MECHANICAL POLISHING UTILIZING LASER SINTERING
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a polishing pad for porous chemical mechanical polishing. <P>SOLUTION: This method includes a process for forming a sintering chamber by drawing a drawable surface and a process for distributing thermoplastic particles having an average particle diameter of 5 to 500 microns to the sintering chamber via a dispenser. The method further includes a process for focusing a laser beam from a laser on the thermoplastic particles and a process for selectively sintering the thermoplastic particles with the laser beam. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007301715(A) 申请公布日期 2007.11.22
申请号 JP20070100014 申请日期 2007.04.06
申请人 ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC 发明人 SAIKIN ALAN H
分类号 B24B37/00;C08J9/24;H01L21/304 主分类号 B24B37/00
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