发明名称 |
METHOD OF FORMING POLISHING PAD FOR CHEMICAL MECHANICAL POLISHING UTILIZING LASER SINTERING |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a polishing pad for porous chemical mechanical polishing. <P>SOLUTION: This method includes a process for forming a sintering chamber by drawing a drawable surface and a process for distributing thermoplastic particles having an average particle diameter of 5 to 500 microns to the sintering chamber via a dispenser. The method further includes a process for focusing a laser beam from a laser on the thermoplastic particles and a process for selectively sintering the thermoplastic particles with the laser beam. <P>COPYRIGHT: (C)2008,JPO&INPIT |
申请公布号 |
JP2007301715(A) |
申请公布日期 |
2007.11.22 |
申请号 |
JP20070100014 |
申请日期 |
2007.04.06 |
申请人 |
ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC |
发明人 |
SAIKIN ALAN H |
分类号 |
B24B37/00;C08J9/24;H01L21/304 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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