| 摘要 |
<p>[PROBLEMS] To provide an electronic component, which can improve adhesion particularly between an electrode layer and a resistor layer and, at the same time, can improve the strength of the electrode layer and the resistor layer, and a method for manufacturing the same. [MEANS FOR SOLVING PROBLEMS] An electrode layer (22) comprises a composite powder comprising silver as a main component and bismuth oxide or carbon, or comprising silver as a main component and bismuth oxide and carbon. As compared with a silver powder, the composite powder is less likely to be melted at a firing temperature for curing a binder resin. Accordingly, as compared with the prior art technique, heat generation caused by the melting can be properly suppressed. As a result, decomposition of the binder resin and the like can be suppressed. Accordingly, the adhesion between the resistor layer and the electrode layer can be properly improved, and, at the same time, the strength of the resistor layer and the electrode layer can be improved, and when a transfer plate (30) is separated, the resistor layer is not separated together with the transfer plate (30) and, thus, a transfer-type substrate can be stably formed.</p> |
