发明名称 Device for reducing dew in electronic device, has housing, electronic or electro mechanical component arranged in housing and insertion bodies made of non conducting material arranged between one of components and empty space in housing
摘要 <p>The device has a housing and an electronic or electromechanic component arranged in the housing. The insertion bodies (1,2) made of non conducting material, are arranged between one of the components and the empty space available in the housing. The insertion bodies are inserted in flexible form. The insertion bodies act as warm-exhausting. The surface of the insertion body consists of two different materials, where one of the materials has a higher thermal capacity or higher heat conductivity.</p>
申请公布号 DE102006023134(A1) 申请公布日期 2007.11.22
申请号 DE20061023134 申请日期 2006.05.17
申请人 SIEMENS AG 发明人 KLOSTERMEIER, DIETER;SELLENT, MANFRED;TAYLOR, MACK;WAHLER, TORSTEN
分类号 H05K5/02;H05K7/20 主分类号 H05K5/02
代理机构 代理人
主权项
地址