| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device with higher reliability than in prior art by restraining mechanical stress from being applied to a semiconductor chip owing to a difference of thermal expansion between a heat dissipation plate and a package substrate. SOLUTION: A heat sink 37 includes a center lower surface side bonded to a semiconductor chip 32, and an edge upper surface side brought into contact with a heat sink press 36a and is held and sandwiched between the semiconductor chip 32 and the heat sink press part 36a. The heat sink 37 and the heat sink press part 36a are not joined with a gap provided between the heat sink 37 and a frame 36. Consequently, the frame 36 does not suffer from stress applied owing to thermal expansion of the heat sink 37, even though the heat sink 37 is thermally expanded owing to heat produced in the semiconductor chip 32. It is therefore possible to avoid mechanical stress caused by the thermal expansion of the heat sink 37 and applied to a circumferential junction of the semiconductor chip 32 through the package substrate 31. This improves the reliability of the semiconductor device. COPYRIGHT: (C)2008,JPO&INPIT
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