| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a wiring board capable of increasing the melting point of a metallic material, even when a hole is filled with the metallic material having the low melting point and having a through electrode having the high melting point in the case of a packaging. SOLUTION: The manufacturing method for the wiring board has at least a first process forming fine holes in a base material, and a second process forming first metallic film to at least a part in the fine holes. The manufacturing method for the wiring board further has at least a third process filling the insides of the fine holes with the metallic material having the melting point lower than the first metallic film, and a fourth process forming an alloy having the melting point higher than the metallic material by a heat treatment. COPYRIGHT: (C)2008,JPO&INPIT
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