发明名称 Resin Composition
摘要 It is an object to provide a resin composition in which fluidity is conferred while maintaining the high heat resistance of a highly heat-resistant non-crystalline resin, an amount of foreign matter is greatly reduced, there is no mold deposit, the metering stability is excellent, and the transparency is also good, and a resin composition in which good heat resistance and fluidity are both achieved, the amount of foreign matter is reduced, generation of fines is reduced, and there is no bleeding out. According to the present invention, there is provided a resin composition comprising; (A) a resin component comprising 70 to 100% by weight of at least one resin selected from the group consisting of a polyphenylene ether resin, a polycarbonate resin, a polysulfone resin, a polyethersulfone resin, a polyarylate resin, a polyamide-imide resin, a polyetherimide resin, and a thermoplastic polyimide resin; and (B) an organic compound having a melting point of not less than 200° C., the organic compound being from 0.1 to 40 parts by weight based on 100 parts by weight of the resin component (A).
申请公布号 US2007270530(A1) 申请公布日期 2007.11.22
申请号 US20050665369 申请日期 2005.10.07
申请人 KAMO HIROSHI;KURIHARA TETSUO 发明人 KAMO HIROSHI;KURIHARA TETSUO
分类号 C08L67/00;C08L25/00;C08L43/00;C08L69/00;C08L77/00;C08L79/04;C08L81/06 主分类号 C08L67/00
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