发明名称 |
PACKAGED DEVICES AND METHODS FOR FORMING PACKAGED DEVICES |
摘要 |
Packaged devices and methods of forming packaged devices are provided. At least one device is disposed on a substrate. The material layer encapsulates the device and covers at least a portion of the substrate, wherein the material layer comprises at least a first portion adjacent to the device and a second portion over the first portion. The second portion has a thermal conductivity higher than a thermal conductivity of the first portion.
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申请公布号 |
US2007267737(A1) |
申请公布日期 |
2007.11.22 |
申请号 |
US20060383922 |
申请日期 |
2006.05.17 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
CHEN HSIEN-WEI;CHEN HSUEH-CHUNG;CHENG YI-LUNG |
分类号 |
H01L23/15 |
主分类号 |
H01L23/15 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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