| 摘要 |
<P>PROBLEM TO BE SOLVED: To realize highly accurate positioning of a movable table for moving a semiconductor wafer by utilizing an alignment mark formed on a semiconductor wafer. <P>SOLUTION: A work stage 34 is positioned with higher accuracy through correction as required by obtaining information about global alignment error and step feed error, on the basis of the result of detection in change of position of the lines L1 and L2 with an alignment unit 50, when a first slider 26 is moved in the X-axis direction under the condition that a wafer 18A for adjustment under the global alignment state using the marks D, E for adjustment of global alignment is held with a wafer chuck 36, and when a second slider 30 is moved in the Y-axis direction. <P>COPYRIGHT: (C)2008,JPO&INPIT |
