| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lighting device capable of realizing downsizing. <P>SOLUTION: A heat radiating land 290 is formed along the upper end 200A (end part) on a child substrate 200, and a conduction land 220 is formed on the opposite side to the upper end 200A of the child substrate 200 through the heat generating land 240. Furthermore, the heat generating part 120 of a light-emitting diode module 100 is led out in right and left direction from the right and left side of the case 110, and the connecting terminal 130 is led out from the lower part of the case part 110 to the lower direction. Then, the heat radiating part 120 is soldered to the heat radiating land 240, and the connecting terminal 130 is soldered to each conductive land 220. <P>COPYRIGHT: (C)2008,JPO&INPIT |
