| 摘要 |
PROBLEM TO BE SOLVED: To obtain a method for manufacturing an electronic component capable of suppressing a short-circuit caused by a conductive adhesive agent, and to provide the electronic component and electronic equipment. SOLUTION: An upper layer outside electrode (a second outside electrode) 6 electrically connected to a spiral coil formed in a sintered body 10 is formed by respectively immersing the both end parts of the sintered body 10 with foundation outside electrodes (first outside electrodes) 4, 5 formed into an Ag/Pd paste bathig fluid. The obtained lamination coil component 1A comprises an almost all regions of outside electrodes formed on a mounting surface 1a compising two layers with the electrodes 4, 5 and the electrode 6 laminated. COPYRIGHT: (C)2008,JPO&INPIT
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