| 摘要 |
PROBLEM TO BE SOLVED: To provide a linked lead frame for which operations in each of processes such as wire bonding and resin sealing in manufacturing a semiconductor device can be executed with high productivity, and to provide a manufacturing method thereof. SOLUTION: In the linked lead frame 1, a first rigidity providing streaks 10 continuously extending in the arrangement direction of lead frame single bodies are provided on both sides with the lead frame single bodies 2 sandwiched in a supporting frame, and second rigidity providing streaks 20 continuously extending along the widthwise direction of an ultra-thin metal plate and crossing the first rigidity streaks 10 are formed between the lead frame single bodies in the supporting frame. COPYRIGHT: (C)2008,JPO&INPIT |
