FLEXIBLE CIRCUIT SUBSTRATE WITH ENHANCED FLEXIBILITY

摘要

PROBLEM TO BE SOLVED: To provide a flexible circuit substrate with enhanced flexibility without comparatively limiting a material to be used. SOLUTION: The flexible circuit substrate 10 is obtained by forming a circuit 13 with copper foil on a first base film 14, and allowing an adhesive layer 12 to adhere onto a coverlay film including a second base film 11 so as to protect the circuit. The flexibility of an FPC is enhanced by using a film with the MIT flaw coefficient of not less than 30 concerning the first base film 14 and/or the second base film 11. COPYRIGHT: (C)2008,JPO&INPIT