| 摘要 |
PROBLEM TO BE SOLVED: To provide a porous substrate having no defect but uniform predetermined thickness as a dielectric film usable for electronic circuit substrates, and to provide a method for easily obtaining such porous substrates. SOLUTION: The method for producing a porous substrate 6 formed by using a molding container comprises providing sol at atmospheric pressure and gelling the sol in the molding container by heating the sol at a higher pressure than the atmospheric pressure. COPYRIGHT: (C)2008,JPO&INPIT
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