| 发明名称 |
INTEGRATED CIRCUIT SHIELD STRUCTURE AND METHOD OF FABRICATION THEREOF |
| 摘要 |
Embodiments of the invention provide an integrated circuit structure comprising: a substrate; a shield structure comprising a shield member and a ground strap formed on the substrate, wherein the shield member comprises a non-metallic portion, and the ground strap comprises a metallic portion.
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| 申请公布号 |
US2007268093(A1) |
申请公布日期 |
2007.11.22 |
| 申请号 |
US20070832642 |
申请日期 |
2007.08.01 |
| 申请人 |
CHARTERED SEMICONDUCTOR MANUFACTURING, LTD. |
发明人 |
LIM SUH FEI;CHEW KOK WAI;CHU SANFORD S.;CHENG MICHAEL C.H. |
| 分类号 |
H03H7/00 |
主分类号 |
H03H7/00 |
| 代理机构 |
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